德邦半导体产业混合发起式C(014320)资产配置
序号 |
报告期 |
股票占净比(%) |
债券占净比(%) |
现金占净比(%) |
净资产(元) |
1 |
2025-03-31 |
93.39 |
- |
6.70 |
2,516,390,425.87 |
2 |
2024-12-31 |
92.35 |
- |
11.15 |
2,040,269,573.56 |
3 |
2024-09-30 |
93.61 |
- |
6.51 |
3,027,155,200.56 |
4 |
2024-06-30 |
92.96 |
- |
7.53 |
2,554,535,780.30 |
5 |
2024-03-31 |
93.20 |
- |
9.57 |
2,660,888,512.44 |
6 |
2023-12-31 |
93.06 |
- |
7.56 |
3,025,013,951.35 |
7 |
2023-09-30 |
92.95 |
- |
8.33 |
2,866,231,189.18 |
8 |
2023-06-30 |
92.97 |
- |
8.47 |
2,675,678,187.32 |
9 |
2023-03-31 |
93.15 |
- |
11.34 |
879,742,125.39 |
10 |
2022-12-31 |
92.57 |
- |
10.52 |
189,353,457.37 |
11 |
2022-09-30 |
91.65 |
- |
10.23 |
175,228,133.34 |
12 |
2022-06-30 |
92.92 |
- |
7.99 |
16,885,683.11 |
13 |
2022-03-31 |
81.36 |
- |
19.52 |
11,290,516.09 |